17" Fanless Panel PC TPC-317 EHL - Celeron J6412

Durable and Interactive Visual Interface

This Panel PC integrates a 17-inch TFT LCD screen with a 4:3 aspect ratio and an XGA resolution of 1024 x 768, providing a clear and precise display. The screen benefits from a brightness of 300 nits and an excellent contrast ratio of 2000, ensuring good readability even in varying lighting conditions. It is capable of displaying 16.2 million colors and offers wide viewing angles of 176/176 for comfortable viewing from multiple positions. Interaction is facilitated by a resistive touch technology, known for its durability and reliability in industrial settings. Its aluminum front panel is IP66 certified, effectively protecting it against dust and water jets, making it perfectly suited for industrial environments.

Extended Connectivity and Expansion Capabilities

The Advantech TPC-317 EHL features comprehensive connectivity for easy integration into existing infrastructures. It includes two Ethernet ports for stable network communication, as well as four USB ports, including three USB 3.0 and one USB 2.0, for peripheral connections. Two serial ports, one RS-232 and one RS-232/422/485, ensure broad compatibility with various industrial equipment. A DisplayPort (DP) output is available for connecting an external display, and an audio input/output is included. Its expansion capabilities are enhanced by a Full-Size Mini PCI-E slot and two M.2 extension slots, as well as compatibility with Advantech's iDoor technology for additional I/O functionalities. Power is supplied by a 24 VDC input with a typical consumption of 35.8 W.

Modular Expansion with Advantech iDoor Technology

Advantech iDoor technology represents an innovative modular approach to extending the functionalities of industrial Panel PCs and other embedded devices. Based on the Mini PCIe format, these modules allow system integrators to precisely choose the I/O functions they need, thus avoiding the acquisition of expensive equipment with superfluous features. iDoor modules offer great flexibility for integrating various capabilities, including industrial Fieldbus protocols (such as Profibus, Profinet, EtherCAT, Powerlink), memory and storage expansions, wired or wireless communication options (Wi-Fi, 3G, LTE, GPS, RFID, Bluetooth), and digital and analog I/Os. This modular design not only simplifies assembly and installation through standardized components and clear interfaces but also ensures future scalability of systems, allowing for easy upgrades as technologies or application needs change.